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Design to excel in heavy workload with our unrivaled SLC NAND solution
Design to excel in heavy workload with our unrivaled SLC NAND solution
Design to excel in heavy workload with our unrivaled SLC NAND solution

Samsung SLC NAND, suited for high-level performance, manages industrial devices that call for data integrity and top-grade reliability. Samsung SLC NAND, suited for high-level performance, manages industrial devices that call for data integrity and top-grade reliability. Samsung SLC NAND, suited for high-level performance, manages industrial devices that call for data integrity and top-grade reliability.

9 Results
All Products
  • EOL
    SLC NAND
    K9F1G08U0F-5IB0
    Density
    1 GB
    Organization
    x8
    VCC Range
    2.7 ~ 3.6 V
    I/O Speed
    40 Mbps
    Package Type
    FBGA
    Number of Pins
    63
    Temperature
    -40 ~ 85 °C
    ECC
    On-Chip ECC
    Product Status
    EOL
    Learn more
  • EOL
    SLC NAND
    K9F1G08U0F-SIB0
    Density
    1 GB
    Organization
    x8
    VCC Range
    2.7 ~ 3.6 V
    I/O Speed
    40 Mbps
    Package Type
    TSOP
    Number of Pins
    48
    Temperature
    -40 ~ 85 °C
    ECC
    On-Chip ECC
    Product Status
    EOL
    Learn more
  • EOL
    SLC NAND
    K9F2G08U0D-5IB0
    Density
    2 GB
    Organization
    x8
    VCC Range
    2.7 ~ 3.6 V
    I/O Speed
    40 Mbps
    Package Type
    FBGA
    Number of Pins
    63
    Temperature
    -40 ~ 85 °C
    ECC
    On-Chip ECC
    Product Status
    EOL
    Learn more
  • EOL
    SLC NAND
    K9F2G08U0D-SIB0
    Density
    2 GB
    Organization
    x8
    VCC Range
    2.7 ~ 3.6 V
    I/O Speed
    40 Mbps
    Package Type
    TSOP
    Number of Pins
    48
    Temperature
    -40 ~ 85 °C
    ECC
    On-Chip ECC
    Product Status
    EOL
    Learn more
  • EOL
    SLC NAND
    K9F4G08U0F-5IB0
    Density
    4 GB
    Organization
    x8
    VCC Range
    2.7 ~ 3.6 V
    I/O Speed
    40 Mbps
    Package Type
    FBGA
    Number of Pins
    63
    Temperature
    -40 ~ 85 °C
    ECC
    On-Chip ECC
    Product Status
    EOL
    Learn more
  • EOL
    SLC NAND
    K9F4G08U0F-SIB0
    Density
    4 GB
    Organization
    x8
    VCC Range
    2.7 ~ 3.6 V
    I/O Speed
    40 Mbps
    Package Type
    TSOP
    Number of Pins
    48
    Temperature
    -40 ~ 85 °C
    ECC
    On-Chip ECC
    Product Status
    EOL
    Learn more
  • EOL
    SLC NAND
    K9F8G08U0F-5IB0
    Density
    8 GB
    Organization
    x8
    VCC Range
    2.7 ~ 3.6 V
    I/O Speed
    40 Mbps
    Package Type
    FBGA
    Number of Pins
    63
    Temperature
    -40 ~ 85 °C
    ECC
    On-Chip ECC
    Product Status
    EOL
    Learn more
  • EOL
    SLC NAND
    K9K8G08U0F-SIB0
    Density
    8 GB
    Organization
    x8
    VCC Range
    2.7 ~ 3.6 V
    I/O Speed
    40 Mbps
    Package Type
    TSOP
    Number of Pins
    48
    Temperature
    -40 ~ 85 °C
    ECC
    On-Chip ECC
    Product Status
    EOL
    Learn more

Up to three products are comparable at the same time. Click Export button to compare more than three products.

All product specifications reflect internal test results and are subject to variations by the user's system configuration

All product images shown are for illustration purposes only and may not be an exact representation of the product

Samsung reserves the right to change product images and specifications at any time without notice

For further details on product specifications, please contact the sales representative of your region.

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